Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8847453 | Rotor and method for manufacturing a rotor of an electric machine | Ludwig Erd, Ulrich Hartmann, Torsten Metzner, Axel Möhle | 2014-09-30 |
| 8198783 | Piezoelectric actuator with encapsulation layer having a thickness-varying property gradient | Hellmut Freudenberg, Axel Ganster, Christoph Hamann, Oliver HENNING, Jens Dahl Jensen +3 more | 2012-06-12 |
| 7851978 | Piezo actuator comprising a multilayer encapsulation, and method for the production thereof | Hellmut Freudenberg, Axel Ganster, Christoph Hamann, Oliver Hennig, Jens Dahl Jensen +4 more | 2010-12-14 |
| 7255926 | Barrier layer made of a curable resin containing polymeric polyol | Hermann Calwer, Dieter Dlugosch, Gudrun Kühne | 2007-08-14 |
| 6931699 | Method of producing a surface wave component with a drain for pyroelectric voltage | Wolfgang Pahl | 2005-08-23 |
| 6692986 | Method for encapsulating components | Wolfgang Rogler, Wolfgang Roth | 2004-02-17 |
| 6297344 | Heat-setting single-component LVA (low viscosity adhesive) system for bonding in the micro-range | Klaus Höhn | 2001-10-02 |
| 6207732 | Heat-setting single-component LVA (low-viscosity adhesive) system for bonding in the micro-range | Klaus Hoehn, Martin Honsberg-Riedl | 2001-03-27 |
| 6200408 | Method for cementing a component to a surface | Ernst Wipfelder | 2001-03-13 |
| 6160077 | Halogen-free epoxy resin | Walter Fischer, Wilhelm Hekele, Ernst Wipfelder | 2000-12-12 |
| 6150435 | One-component epoxy resin for covering electronic components | Barbara Lehner, Ernst Wipfelder | 2000-11-21 |
| 5900286 | Method of producing an attenuating structure on a surface wave component | Walter Fischer, Winfried Plundrich, Hans Stelzl, Wolfgang Pahl | 1999-05-04 |
| 5576357 | One-component reactive resin system comprising a cure-inhibiting glycidyl phosphorus compound | Winfried Plundrich, Ernst Wipfelder | 1996-11-19 |
| 5468786 | Radiation-curable reaction resin system | Barbara Lehner, Michael Rogalli | 1995-11-21 |
| 5366573 | UV-curable adhesive semiconductor chip mounting process | Barbara Lehner, Oskar Wirbser, Gregor Unger | 1994-11-22 |
| 5242715 | Process for coating or bonding electronic components and subassemblies | Lothar Schoen, Bernhard Stapp, Helmut Markert, Volker Muhrer | 1993-09-07 |
| 5227219 | Surface wave components with an acoustically matched damping compound | Michael Rogalli, Frank Dittrich, Hans Stelzl | 1993-07-13 |
| 5158990 | Coating compounds for electrical and electronic components containing vitreons fused silica | Barbara Lehner, Hans-Peter Fritsch, Kurt Wohak | 1992-10-27 |
| 4970399 | Method and apparatus for processing UV-hardenable reaction resin compounds | Reiner Habrich | 1990-11-13 |
| 4880662 | Method and apparatus for processing UV-hardenable reaction resin compounds | Reiner Habrich | 1989-11-14 |