Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7352001 | Method of editing a semiconductor die | Kevin Weaver, Lakshmi Durbha | 2008-04-01 |
| 7279343 | De-packaging process for small outline transistor packages | Kevin Weaver, Hiep V. Nguyen | 2007-10-09 |
| 7087927 | Semiconductor die with an editing structure | Kevin Weaver, Lakshmi Durbha | 2006-08-08 |
| 6518074 | Backside IC device preparation process | Hiep V. Nguyen, Smith J. Johnson, Kevin Weaver | 2003-02-11 |