HI

Hamdan Ismail

NU Nxp Usa: 3 patents #546 of 2,066Top 30%
Overall (All Time): #1,374,263 of 4,157,543Top 35%
3
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12087671 Overmolded microelectronic packages containing knurled flanges and methods for the production thereof Audel A. Sanchez, Jerry L. White, Frank E. Danaher, David J. Dougherty, Aruna Manoharan 2024-09-10
10998255 Overmolded microelectronic packages containing knurled flanges and methods for the production thereof Audel A. Sanchez, Jerry L. White, Frank E. Danaher, David J. Dougherty, Aruna Manoharan 2021-05-04
9607953 Semiconductor package with isolation wall Lu Li, Samy R. N. Naidu, Mahesh K. Shah 2017-03-28