Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5632438 | Direct chip attachment process and apparatus for aluminum wirebonding on copper circuitization | Mark K. Hoffmeyer, Connie Jean Mathison | 1997-05-27 |
| 5275330 | Solder ball connect pad-on-via assembly process | Phillip Duane Isaacs, Miles Frank Swain, Burton A. Towne | 1994-01-04 |