Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6551859 | Chip scale and land grid array semiconductor packages | Shaw Wei Lee, Thanh Lequang, Wayne Lee, William Jeffery Schaefer | 2003-04-22 |
| 6396135 | Substrate for use in semiconductor packaging | Shaw Wei Lee | 2002-05-28 |