Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6498394 | IC packages with diamond substrate thermal conductor | — | 2002-12-24 |
| 6058602 | Method for encapsulating IC packages with diamond substrate | — | 2000-05-09 |
| 5859477 | Apparatus for encapsulating IC packages with diamond substrate thermal conductor | — | 1999-01-12 |
| 5817941 | Method and apparatus for supporting a sensor in a vehicle | Willfred Marc Stalnaker, George Fujimoto, Victor Wayne Ramsey, David Alexander St. Clair V | 1998-10-06 |
| 5682673 | Method for forming encapsulated IC packages | — | 1997-11-04 |
| 5491110 | Metal semiconductor package with an external plastic seal | Victor Batinovich | 1996-02-13 |
| 5436407 | Metal semiconductor package with an external plastic seal | Victor Batinovich | 1995-07-25 |