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Method of making a low mass foam electrical structure |
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Method of making a low mass foam electrical structure |
Steven J. Mass, Anthony L. Long, Mansoor K. Siddiqui, Marijan D. Grgas |
2018-11-06 |
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Waveguide and semiconductor packaging |
Chunbo Zhang, Peter Dinh-Tuan Ngo, Kevin M. Leong, Patty Chang-Chien, Kelly J. Hennig +1 more |
2018-05-01 |
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Waveguide and semiconductor packaging |
Chunbo Zhang, Peter Dinh-Tuan Ngo, Kevin M. Leong, Patty Chang-Chien, Kelly J. Hennig +1 more |
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RF transmission line disposed within a conductively plated cavity located in a low mass foam housing |
Steven J. Mass, Anthony L. Long, Mansoor K. Siddiqui, Marijan D. Grgas |
2016-03-22 |
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Method for packaging integrated circuit chips |
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2006-11-14 |
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High performance vias for vertical IC packaging |
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High power chip scale package |
James M. Anderson |
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Chip-to-board connection assembly and method therefor |
James M. Anderson, John W. Spargo, Benjamin Tang |
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Method for forming high frequency connections to high temperature superconductor circuits and other fragile materials |
Karen E. Yokoyama, Moshe Sergant |
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Method for parallel alignment of a chip to substrate |
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Process of fabricating high frequency connections to high temperature superconductor circuits |
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Reworkable microelectronic multi-chip module |
Karen E. Yokoyama |
2000-04-18 |
| 6032852 |
Reworkable microelectronic multi-chip module |
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Cryogenic flex cable connector |
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Reworkable microelectronic multi-chip module |
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1999-07-06 |