Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424585 | Apparatus for bonding chip band and method for bonding chip using the same | Huijae Kim, Mingu LEE, Hyeonggyun Cheong, Yunpyo Hong | 2025-09-23 |
| 12136563 | Semiconductor manufacturing apparatus including bonding head | Mingu LEE, Chulhyun Park, Kangsan Lee, Eunhaeng Lee | 2024-11-05 |