HK

Huijae Kim

TU T-Mobile Usa: 4 patents #332 of 1,165Top 30%
Samsung: 2 patents #37,631 of 75,807Top 50%
📍 Jeju, WA: #1 of 1 inventorsTop 100%
Overall (All Time): #789,287 of 4,157,543Top 20%
6
Patents All Time

Issued Patents All Time

Showing 1–6 of 6 patents

Patent #TitleCo-InventorsDate
12424585 Apparatus for bonding chip band and method for bonding chip using the same Euisun Choi, Mingu LEE, Hyeonggyun Cheong, Yunpyo Hong 2025-09-23
12027401 Semiconductor substrate alignment device and a semiconductor substrate bonding system using the same Gwanghee Jo, Dongjoo Moon, Siwoong WOO, Sunjung Kim, Donggil Shim +1 more 2024-07-02
11743393 Identifying and resolving telecommunication network problems using network experience score Ting Zhang, Juan Murillo Pacheco, Arundhati Ghosh, Xiao Zhang, Prem Kumar Bodiga 2023-08-29
11510050 Determining technological capability of devices having unknown technological capability and which are associated with a telecommunication network Ajay Meenkumar 2022-11-22
11343381 Identifying and resolving telecommunication network problems using network experience score Ting Zhang, Juan Murillo Pacheco, Arundhati Ghosh, Xiao Zhang, Prem Kumar Bodiga 2022-05-24
11006268 Determining technological capability of devices having unknown technological capability and which are associated with a telecommunication network Ajay Meenkumar 2021-05-11