Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9324674 | Die substrate assembly and method | Johannes Wilhelmus van Rijckevorsel | 2016-04-26 |
| 9263335 | Discrete semiconductor device package and manufacturing method | Tim Boettcher, Sven Walczyk, Roelf Anco Jacob Groenhuis, Rolf Brenner | 2016-02-16 |
| 9153529 | Pre-soldered leadless package | Jan van Kempen, René Wilhelmus Johannes Maria van den Boomen | 2015-10-06 |
| 8981566 | Discrete semiconductor device package and manufacturing method | Tim Boettcher, Sven Walczyk, Roelf Anco Jacob Groenhuis, Rolf Brenner | 2015-03-17 |
| 8728929 | Pre-soldered leadless package | Jan van Kempen, René Wilhelmus Johannes Maria van den Boomen | 2014-05-20 |