Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11399439 | Methods of forming high aspect ratio plated through holes and high precision stub removal in a printed circuit board | Shinichi Iketani, Dale Kersten | 2022-07-26 |
| 10811210 | Multilayer printed circuit board via hole registration and accuracy | Shinichi Iketani | 2020-10-20 |
| 10446356 | Multilayer printed circuit board via hole registration and accuracy | Shinichi Iketani | 2019-10-15 |
| 10188001 | Methods of forming high aspect ratio plated through holes and high precision stub removal in a printed circuit board | Shinichi Iketani, Dale Kersten | 2019-01-22 |
| 9661758 | Methods of segmented through hole formation using dual diameter through hole edge trimming | Shinichi Iketani | 2017-05-23 |