Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10957575 | Method for connecting a buried interconnect rail and a semiconductor fin in an integrated circuit chip | Anshul Gupta | 2021-03-23 |
| 9601379 | Methods of forming metal source/drain contact structures for semiconductor devices with gate all around channel structures | Bartlomiej Jan Pawlak, Pieter Schuddinck | 2017-03-21 |