Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9318350 | Method and apparatus for converting commerical off-the-shelf (COTS) thin small-outline package (TSOP) components into rugged off-the-shelf (ROTS) components | Melvin Eric Graf | 2016-04-19 |
| 8726498 | Methods for filling holes in printed wiring boards | Chris Simon | 2014-05-20 |
| 8549737 | Method of connecting a grid array package to a printed circuit board | — | 2013-10-08 |
| 8481862 | Low profile compliant leads | Melvin Eric Graf | 2013-07-09 |
| 8196291 | Method for manufacturing leads | — | 2012-06-12 |
| 8028403 | Method for forming laminated multiple substrates | Ronald R. Denny | 2011-10-04 |
| 7892441 | Method and apparatus to change solder pad size using a differential pad plating | — | 2011-02-22 |
| 7818879 | Method and apparatus for compliantly connecting stack of high-density electronic modules in harsh environments | — | 2010-10-26 |
| 7802360 | Methods for filling holes in printed wiring boards | Chris Simon | 2010-09-28 |
| 7684205 | System and method of using a compliant lead interposer | — | 2010-03-23 |
| 7614341 | Apparatus and method for a segmented squeegee for stenciling | Scott P. Lichtenauer | 2009-11-10 |
| 7503767 | Method and apparatus for compliantly connecting stack of high-density electronic modules in harsh environments | — | 2009-03-17 |
| 7490402 | Technique for laminating multiple substrates | Ronald R. Denny | 2009-02-17 |
| 7282787 | Laminated multiple substrates | Ronald R. Denny | 2007-10-16 |
| 6856008 | Laminated multilayer package | Ronald R. Denny | 2005-02-15 |
| 6742247 | Process for manufacturing laminated high layer count printed circuit boards | Ronald R. Denny | 2004-06-01 |
| 5986339 | Laminated multilayer substrates | Ronald R. Denny, Jeanne M. Chevalier, George F. Schwartz, III, Clark F. Webster, Robert M. Lufkin +1 more | 1999-11-16 |
| 5953816 | Process of making interposers for land grip arrays | Leo Marvin Rosenstein, Lowell Dennis Lund | 1999-09-21 |
| 5871868 | Apparatus and method for machining conductive structures on substrates | — | 1999-02-16 |
| 5786238 | Laminated multilayer substrates | Ronald R. Denny, Jeanne M. Chevalier, George F. Schwartz, III, Clark F. Webster, Robert M. Lufkin +1 more | 1998-07-28 |
| 5746367 | Method and apparatus to wick solder from conductive surfaces | Lowell Dennis Lund | 1998-05-05 |
| 5740954 | Apparatus for attaching/detaching a land grid array component to a circuit board | Allen Lee Bringewatt | 1998-04-21 |