Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5953816 | Process of making interposers for land grip arrays | Deepak K. Pai, Leo Marvin Rosenstein | 1999-09-21 |
| 5746367 | Method and apparatus to wick solder from conductive surfaces | Deepak K. Pai | 1998-05-05 |
| 5466540 | Mark of an electronic component lid | Deepak Pai, Gene A. Maday | 1995-11-14 |
| 5399239 | Method of fabricating conductive structures on substrates | Deepak Pai | 1995-03-21 |