Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10631407 | Circuit board with non-plated hole interposed between plated holes to prevent formation of conductive anodic filament | Jennifer Oliver, Ashok Kumar Singh, Musan Hu | 2020-04-21 |
| 8889999 | Multiple layer printed circuit board with unplated vias | Aritharan Thurairajaratnam | 2014-11-18 |
| 7935895 | Structuring and circuitizing printed circuit board through-holes | Joe Dickson | 2011-05-03 |
| 6994757 | Resistive materials | Craig Allen, John Schemenaur, Marc Langlois, Xiaodong Hu, Jan Tzyy-Jiuan Hwang +2 more | 2006-02-07 |
| 6846370 | Resistive materials | Craig Allen, John Schemenaur, Marc Langlois, Xiaodong Hu, Jan Tzyy-Jiuan Hwang +2 more | 2005-01-25 |