Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10056297 | Modified plasma dicing process to improve back metal cleaving | Paul C. Lindsey, Jr. | 2018-08-21 |
| 8906745 | Method using fluid pressure to remove back metal from semiconductor wafer scribe streets | Paul C. Lindsey, Jr. | 2014-12-09 |