Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12237202 | Die bonding system with heated automatic collet changer | Nicholas Samuel Celia, Jr. | 2025-02-25 |
| 11791197 | Die bonding system with wafer lift and level assembly | Nicholas Samuel Celia, Jr. | 2023-10-17 |
| 9911710 | Thermo-compression bonding system, subsystems, and methods of use | Nicholas Samuel Celia, Jr. | 2018-03-06 |
| 6389688 | Method and apparatus for chip placement | Nilendu Srivastava, Sung Ping Sun | 2002-05-21 |
| 6220487 | Dispensing apparatus | Nilendu Srivastava, Carl Ito | 2001-04-24 |