Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12237202 | Die bonding system with heated automatic collet changer | Cyriac Devasia | 2025-02-25 |
| 11791197 | Die bonding system with wafer lift and level assembly | Cyriac Devasia | 2023-10-17 |
| 10588981 | Die placement head with turret | — | 2020-03-17 |
| 9911710 | Thermo-compression bonding system, subsystems, and methods of use | Cyriac Devasia | 2018-03-06 |