Issued Patents All Time
Showing 25 most recent of 88 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11927616 | Evaluation of wafer carcass alpha particle emission | Michael S. Gordon, Kenneth P. Rodbell | 2024-03-12 |
| 11488862 | Semiconductor device with reduced via resistance | Chih-Chao Yang | 2022-11-01 |
| 11222815 | Semiconductor device with reduced via resistance | Chih-Chao Yang | 2022-01-11 |
| 11069567 | Modulating metal interconnect surface topography | Chih-Chao Yang | 2021-07-20 |
| 10903115 | Controlling grain boundaries in high aspect-ratio conductive regions | Chih-Chao Yang | 2021-01-26 |
| 10804147 | Semiconductor device with reduced via resistance | Chih-Chao Yang | 2020-10-13 |
| 10714379 | Reducing contact resistance in vias for copper interconnects | Chih-Chao Yang | 2020-07-14 |
| 10600686 | Controlling grain boundaries in high aspect-ratio conductive regions | Chih-Chao Yang | 2020-03-24 |
| 10553483 | Semiconductor device with reduced via resistance | Chih-Chao Yang | 2020-02-04 |
| 10522398 | Modulating metal interconnect surface topography | Chih-Chao Yang | 2019-12-31 |
| 10468296 | Reducing contact resistance in vias for copper interconnects | Chih-Chao Yang | 2019-11-05 |
| 10446491 | Hybrid interconnects and method of forming the same | Chih-Chao Yang | 2019-10-15 |
| 10424504 | Method for forming improved liner layer and semiconductor device including the same | Chih-Chao Yang | 2019-09-24 |
| 10388615 | Activating reactions in integrated circuits through electrical discharge | Cyril Cabral, Jr., Gregory M. Fritz, Kenneth P. Rodbell | 2019-08-20 |
| 10361115 | Reducing contact resistance in vias for copper interconnects | Chih-Chao Yang | 2019-07-23 |
| 10262955 | Activating reactions in integrated circuits through electrical discharge | Cyril Cabral, Jr., Gregory M. Fritz, Kenneth P. Rodbell | 2019-04-16 |
| 10242943 | Forming a stacked capacitor | Chih-Chao Yang | 2019-03-26 |
| 10170358 | Reducing contact resistance in vias for copper interconnects | Chih-Chao Yang | 2019-01-01 |
| 10109586 | Semiconductor device interconnect structures formed by metal reflow process | Chih-Chao Yang | 2018-10-23 |
| 10008421 | Capacitance monitoring using x-ray diffraction | Donghun Kang, Kriteshwar K. Kohli, Oh-Jung Kwon, Anita Madan | 2018-06-26 |
| 9997406 | Columnar interconnects and method of making them | Chih-Chao Yang | 2018-06-12 |
| 9991214 | Activating reactions in integrated circuits through electrical discharge | Cyril Cabral, Jr., Gregory M. Fritz, Kenneth P. Rodbell | 2018-06-05 |
| 9953869 | Semiconductor device with reduced via resistance | Chih-Chao Yang | 2018-04-24 |
| 9929092 | Treating copper interconnects | Chih-Chao Yang | 2018-03-27 |
| 9875959 | Forming a stacked capacitor | Chih-Chao Yang | 2018-01-23 |