Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11869858 | Packaging high-frequency microwave circuits using hot via die attach with interposer | Jeff Luu, Douglas Ryan Jorgesen | 2024-01-09 |
| 8912090 | Mixer fabrication technique and system using the same | — | 2014-12-16 |