Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11869858 | Packaging high-frequency microwave circuits using hot via die attach with interposer | Christopher Ferenc Marki, Jeff Luu | 2024-01-09 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11869858 | Packaging high-frequency microwave circuits using hot via die attach with interposer | Christopher Ferenc Marki, Jeff Luu | 2024-01-09 |