Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8853564 | Air cavity package configured to electrically couple to a printed circuit board and method of providing same | Lik Hang Wan, Ming Wa Tam | 2014-10-07 |
| 8809974 | Semiconductor package for MEMS device and method of manufacturing same | Lik Hang Wan, Ming Wa Tam | 2014-08-19 |
| 8742569 | Semiconductor package configured to electrically couple to a printed circuit board and method of providing same | Lik Hang Wan, Ming Wa Tam | 2014-06-03 |