Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10777457 | Carrier substrate, package, and method of manufacture | — | 2020-09-15 |
| 10458826 | Mass flow sensor module and method of manufacture | — | 2019-10-29 |
| 9991194 | Sensor package and method of manufacture | Ken Lik Hang Wan, Wa San Leung | 2018-06-05 |
| D757538 | Sensor housing | — | 2016-05-31 |
| 8853564 | Air cavity package configured to electrically couple to a printed circuit board and method of providing same | Chi Kwong Lo, Lik Hang Wan | 2014-10-07 |
| 8809974 | Semiconductor package for MEMS device and method of manufacturing same | Chi Kwong Lo, Lik Hang Wan | 2014-08-19 |
| 8742569 | Semiconductor package configured to electrically couple to a printed circuit board and method of providing same | Chi Kwong Lo, Lik Hang Wan | 2014-06-03 |