| 6477447 |
Methods to generate numerical pressure distribution data for developing pressure related components |
— |
2002-11-05 |
| 6441465 |
Scribe line structure for preventing from damages thereof induced during fabrication |
Wei-Tsu Tseng, Min Feng |
2002-08-27 |
| 6323122 |
Structure for a multi-layered dielectric layer and manufacturing method thereof |
— |
2001-11-27 |
| 6307268 |
Suppression of interconnect stress migration by refractory metal plug |
— |
2001-10-23 |
| 6277757 |
Methods to modify wet by dry etched via profile |
— |
2001-08-21 |
| 6235608 |
STI process by method of in-situ multilayer dielectric deposition |
Wei-Tsu Tseng, Min Feng |
2001-05-22 |
| 6204551 |
Modified SOG coater's hot plate to improve SOG film quality |
— |
2001-03-20 |
| 6180997 |
Structure for a multi-layered dielectric layer and manufacturing method thereof |
— |
2001-01-30 |
| 6165886 |
Advanced IC bonding pad design for preventing stress induced passivation cracking and pad delimitation through stress bumper pattern and dielectric pin-on effect |
Wei-Tsu Tseng, Min Feng |
2000-12-26 |
| 6033987 |
Method for mapping and adjusting pressure distribution of CMP processes |
Wen-Tsu Tseng, Min Feng |
2000-03-07 |
| 5969409 |
Combined in-situ high density plasma enhanced chemical vapor deposition (HDPCVD) and chemical mechanical polishing (CMP) process to form an intermetal dielectric layer with a stopper layer embedded therein |
— |
1999-10-19 |
| 5946592 |
Combined in-situ high density plasma enhanced chemical vapor deposition (HDPCVD) and chemical mechanical polishing (CMP) process to form an intermetal dielectric layer with a stopper layer embedded therein |
— |
1999-08-31 |
| 5920792 |
High density plasma enhanced chemical vapor deposition process in combination with chemical mechanical polishing process for preparation and planarization of intemetal dielectric layers |
— |
1999-07-06 |