Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394724 | Chip package structure and electromagnetic interference shielding package module thereof | HSIN-YEH HUANG, Shu-Han Wu | 2025-08-19 |
| 12374629 | Electromagnetic interference shielding package structure, manufacturing method thereof, and electronic assembly | Shu-Han Wu, HSIN-YEH HUANG | 2025-07-29 |
| 12132977 | Image sensor lens assembly and sensing module having open configuration | Meng-Hsin Kuo | 2024-10-29 |
| 12108130 | Image sensor lens assembly and sensing module having externally sealed configuration | Meng-Hsin Kuo | 2024-10-01 |
| 11538730 | Chip scale package structure of heat-dissipating type | HSIN-YEH HUANG, Shu-Han Wu | 2022-12-27 |
| 11309626 | Wireless communication device | HSIN-YEH HUANG, Shu-Han Wu | 2022-04-19 |
| 7680615 | Parallel testing system with shared golden calibration table and method thereof | Chung-Er Huang | 2010-03-16 |
| 7675357 | Multi-system module having functional substrate | Chung-Er Huang | 2010-03-09 |