Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394724 | Chip package structure and electromagnetic interference shielding package module thereof | Chih-Hao Liao, Shu-Han Wu | 2025-08-19 |
| 12374629 | Electromagnetic interference shielding package structure, manufacturing method thereof, and electronic assembly | Chih-Hao Liao, Shu-Han Wu | 2025-07-29 |
| 11538730 | Chip scale package structure of heat-dissipating type | Chih-Hao Liao, Shu-Han Wu | 2022-12-27 |
| 11309626 | Wireless communication device | Chih-Hao Liao, Shu-Han Wu | 2022-04-19 |