CL

Chen-Lin Li

KT Kinsus Interconnect Technology: 1 patents #25 of 37Top 70%
Overall (All Time): #3,297,774 of 4,157,543Top 80%
1
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
7768131 Package structure preventing solder overflow on substrate solder pads Jun Chung Hsu 2010-08-03