Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5060116 | Electronics system with direct write engineering change capability | Warren D. Grobman, by Paula A. Kraus, executrix, Leon L. Wu, Herbert I. Stoller | 1991-10-22 |
| 4803595 | Interposer chip technique for making engineering changes between interconnected semiconductor chips | Leon L. Wu | 1989-02-07 |
| 4688151 | Multilayered interposer board for powering high current chip modules | Herbert I. Stoller, Leon L. Wu | 1987-08-18 |
| 4546413 | Engineering change facility on both major surfaces of chip module | Irving Feinberg, Herbert I. Stoller | 1985-10-08 |
| 4535388 | High density wired module | Herbert I. Stoller, Leon L. Wu | 1985-08-13 |