Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12315818 | Interconnection structure of a semiconductor chip having pads of different widths and semiconductor package including the interconnection structure | Keumhee Ma | 2025-05-27 |
| 12224258 | Semiconductor chip and semiconductor package including the same | Wonkyun Kwon | 2025-02-11 |
| 12021055 | Semiconductor package and method for manufacturing semiconductor package | — | 2024-06-25 |
| 11923286 | Package substrate and semiconductor package including the same | Wonjung Jang | 2024-03-05 |
| 11824023 | Semiconductor chip and semiconductor package including the same | Wonkyun Kwon | 2023-11-21 |
| 11810837 | Semiconductor packages | — | 2023-11-07 |
| 11626370 | Interconnection structure of a semiconductor chip and semiconductor package including the interconnection structure | Keumhee Ma | 2023-04-11 |