Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8053285 | Thermally enhanced single inline package (SIP) | Anthony L. Coyle, William D. Boyd | 2011-11-08 |
| 7612437 | Thermally enhanced single inline package (SIP) | Anthony L. Coyle, William D. Boyd | 2009-11-03 |
| 7498203 | Thermally enhanced BGA package with ground ring | Leland Swanson | 2009-03-03 |
| 7084494 | Semiconductor package having integrated metal parts for thermal enhancement | Anthony L. Coyle, William D. Boyd, Leland Swanson | 2006-08-01 |