Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9299589 | Ball grid array package with laser vias and methods for making the same | Chenglin Liu, Xiaoting Chang | 2016-03-29 |
| 9202797 | Lead frame apparatus and method for improved wire bonding | — | 2015-12-01 |
| 9064784 | Ball grid array package with laser vias and methods for making the same | Chenglin Liu, Xiaoting Chang | 2015-06-23 |
| 8754513 | Lead frame apparatus and method for improved wire bonding | — | 2014-06-17 |
| 8749045 | Metal ring techniques and configurations | — | 2014-06-10 |
| 8741694 | Placing heat sink into packaging by strip formation assembly | Chenglin Liu, Shiann-Ming Liou | 2014-06-03 |
| 8581374 | Placing heat sink into packaging by strip formation assembly | Chenglin Liu, Shiann-Ming Liou | 2013-11-12 |
| 8415785 | Metal ring techniques and configurations | — | 2013-04-09 |
| 8278563 | Via to plating bus | — | 2012-10-02 |