Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9202742 | Integrated circuit packaging system with pattern-through-mold and method of manufacture thereof | Woo Jin Kim, Sun Jae Kim, Hyeon Yi Kang | 2015-12-01 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9202742 | Integrated circuit packaging system with pattern-through-mold and method of manufacture thereof | Woo Jin Kim, Sun Jae Kim, Hyeon Yi Kang | 2015-12-01 |