Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9202742 | Integrated circuit packaging system with pattern-through-mold and method of manufacture thereof | Woo Jin Kim, Sun Jae Kim, Chung Lyul Ahn | 2015-12-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9202742 | Integrated circuit packaging system with pattern-through-mold and method of manufacture thereof | Woo Jin Kim, Sun Jae Kim, Chung Lyul Ahn | 2015-12-01 |