Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10256202 | Durable bond pad structure for electrical connection to extreme environment microelectronic integrated circuits | David J. Spry, Dorothy Lukco, Philip G. Neudeck, Liangyu Chen, Roger D. Meredith +5 more | 2019-04-09 |
| 7519190 | Circuit for reducing pulse noise caused at switching of an analog audio processing circuit | Wei-Cheng Lin, Yi-Fan Shih, Ryan Lee | 2009-04-14 |
| 5701901 | Ultrasonic probe with back and forth sweeping ultrasonic source | Paul Lum, Jerry Zawadzki | 1997-12-30 |