Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6521485 | Method for manufacturing wafer level chip size package | Spencer Su, James Chyi Lai, Lin Chien-Tsun, Captain Chen, Allen Chen +2 more | 2003-02-18 |
| 5944593 | Retainer ring for polishing head of chemical-mechanical polish machines | Daniel T. Chiu, Peng-Yih Peng, J. Y. Wu, J. S. Lai | 1999-08-31 |