Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11437247 | Semiconductor package structure and method for manufacturing the same | Kay Stefan Essig, Jean-Marc Yannou | 2022-09-06 |
| 10177099 | Semiconductor package structure, package on package structure and packaging method | Mark A. Gerber, Rich Rice | 2019-01-08 |
| 4836105 | Direct negative and offset master production using thermal liftoff | Jan-Pieter Hoekstra, Keith S. Pennington | 1989-06-06 |
| 4800397 | Metal transfer to form printing master plate or printed circuit board | Ali Afzali-Ardakani, Mukesh Desai, Jan-Pieter Hoekstra, Keith S. Pennington | 1989-01-24 |