Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354980 | Semiconductor package | Jeong Hoon Ahn, Yun Ki CHOI | 2025-07-08 |
| 11164821 | Semiconductor package | — | 2021-11-02 |
| 9601466 | Semiconductor package and method of manufacturing the same | Jeongwon Yoon, Baikwoo Lee, Hyunsuk Chun | 2017-03-21 |
| 9142498 | Semiconductor devices having stacked solder bumps with intervening metal layers to provide electrical interconnections | Yonghwan Kwon, Sun-Hee Park | 2015-09-22 |