BJ

Bo-Shiun Jiang

CT Chipbond Technology: 1 patents #42 of 88Top 50%
Overall (All Time): #3,168,960 of 4,157,543Top 80%
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Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
8497579 Semiconductor packaging method and structure thereof Cheng-Hung Shih, Shu-Chen Lin, Cheng-Fan Lin, Yung-Wei Hsieh 2013-07-30