Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11961821 | Semiconductor device assemblies including multiple stacks of different semiconductor dies | — | 2024-04-16 |
| 11842984 | Semiconductor device assemblies including stacked individual modules | — | 2023-12-12 |
| 11410969 | Semiconductor device assemblies including multiple stacks of different semiconductor dies | — | 2022-08-09 |
| 11282814 | Semiconductor device assemblies including stacked individual modules | — | 2022-03-22 |
| 10797020 | Semiconductor device assemblies including multiple stacks of different semiconductor dies | — | 2020-10-06 |
| 8084296 | Methods for reducing stress in microelectronic devices and microelectronic devices formed using such methods | — | 2011-12-27 |
| 7573125 | Methods for reducing stress in microelectronic devices and microelectronic devices formed using such methods | — | 2009-08-11 |
| 7102217 | Interposer substrates with reinforced interconnect slots, and semiconductor die packages including same | — | 2006-09-05 |
| 7084489 | Computer system including at least one stress balanced semiconductor package | — | 2006-08-01 |
| 7078823 | Semiconductor die configured for use with interposer substrates having reinforced interconnect slots | — | 2006-07-18 |
| 6879050 | Packaged microelectronic devices and methods for packaging microelectronic devices | David J. Corisis | 2005-04-12 |
| 6855574 | Stress balanced semiconductor packages, method of fabrication and modified mold segment | — | 2005-02-15 |
| 6696748 | Stress balanced semiconductor packages, method of fabrication and modified mold segment | — | 2004-02-24 |