BH

Benjamin Alexander Haag

Dow Global Technologies: 3 patents #1,458 of 4,534Top 35%
DL Ddp Specialty Electronic Materials Us, Llc.: 1 patents #93 of 197Top 50%
Overall (All Time): #1,131,951 of 4,157,543Top 30%
4
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
11739241 High temperature epoxy adhesive formulations Andreas Lutz, Daniel Schneider, Irene Maeder, Marcel Aschwanden 2023-08-29
10815405 One-component epoxy-modified polyurethane and/or polyurea adhesives having high elongation and excellent thermal stability, and assembly processes using same Andreas Lutz, Cathy Grossnickel, Raymond F. Bis 2020-10-27
10435600 Epoxy resin compositions for pre-gel ovens Andreas Lutz, Jeannine Flueckiger, Regina Ditschuneit 2019-10-08
10190028 Epoxy two-part formulations Andreas Lutz, Beda Steiner 2019-01-29