IM

Irene Maeder

DL Ddp Specialty Electronic Materials Us, Llc.: 2 patents #56 of 197Top 30%
Dow Global Technologies: 1 patents #2,632 of 4,534Top 60%
Overall (All Time): #1,398,579 of 4,157,543Top 35%
3
Patents All Time

Issued Patents All Time

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
11739241 High temperature epoxy adhesive formulations Andreas Lutz, Daniel Schneider, Benjamin Alexander Haag, Marcel Aschwanden 2023-08-29
11173672 Method for bonding using one-component epoxy adhesive mixtures Andreas Lutz, Daniel Schneider, Marcel Aschwanden, Michael Ras 2021-11-16
9181463 Structural epoxy resin adhesives containing chain-extended elastomeric tougheners capped with phenol, polyphenol or aminophenol compounds Andreas Lutz, Daniel Schneider, Christof Braendli 2015-11-10