Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872845 | Process for manufacturing a flip chip semiconductor package and a corresponding flip chip package | Mauro MAZZOLA, Matteo DE SANTA | 2020-12-22 |
| 10741415 | Thermosonically bonded connection for flip chip packages | Mauro MAZZOLA, Matteo DE SANTA | 2020-08-11 |
| 10141197 | Thermosonically bonded connection for flip chip packages | Mauro MAZZOLA, Matteo DE SANTA | 2018-11-27 |
| 6581816 | Capillary for bonding copper wires between a semiconductor circuit chip and a corresponding terminal connector of a semiconductor device | Alessandro Frontero | 2003-06-24 |
| 6260753 | Gold bumps bonding on connection pads and subsequent coining of their vertex | Loic Pierre Louis RENARD | 2001-07-17 |