Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406909 | Method of manufacturing semiconductor devices and corresponding semiconductor device | Riccardo VILLA | 2025-09-02 |
| 11967544 | Method of manufacturing semiconductor products, corresponding substrate, semiconductor product and tool | Mauro MAZZOLA | 2024-04-23 |
| 10872845 | Process for manufacturing a flip chip semiconductor package and a corresponding flip chip package | Mauro MAZZOLA, Battista Vitali | 2020-12-22 |
| 10741415 | Thermosonically bonded connection for flip chip packages | Mauro MAZZOLA, Battista Vitali | 2020-08-11 |
| 10141197 | Thermosonically bonded connection for flip chip packages | Mauro MAZZOLA, Battista Vitali | 2018-11-27 |