| 6194482 |
UV-hardenable and thermally hardenable epoxy resins for underfilling electrical and electronic components |
Recai Sezi |
2001-02-27 |
| 6150435 |
One-component epoxy resin for covering electronic components |
Heiner Bayer, Ernst Wipfelder |
2000-11-21 |
| 6037043 |
UV-hardenable and thermally hardenable epoxy resins for underfilling electrical and electronic components |
Recai Sezi |
2000-03-14 |
| 5940550 |
Electrooptical module |
Volker Plickert, Ralf Carl |
1999-08-17 |
| 5468786 |
Radiation-curable reaction resin system |
Heiner Bayer, Michael Rogalli |
1995-11-21 |
| 5366573 |
UV-curable adhesive semiconductor chip mounting process |
Heiner Bayer, Oskar Wirbser, Gregor Unger |
1994-11-22 |
| 5158990 |
Coating compounds for electrical and electronic components containing vitreons fused silica |
Heiner Bayer, Hans-Peter Fritsch, Kurt Wohak |
1992-10-27 |