Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381074 | Method, control system, and system for machining a semiconductor wafer, and semiconductor wafer | Christof Weber, Stefan WELSCH | 2025-08-05 |
| 12325081 | Method for separating a plurality of slices from workpieces by means of a wire saw during a sequence of separation processes | Carl Frintert, Peter Wiesner | 2025-06-10 |
| 12311455 | Method for separating a plurality of slices from workpieces by means of a wire saw during a sequence of separation processes | Patrick Berger, Wolfgang Dietz, Carl Frintert, Matthias Guenther | 2025-05-27 |
| 12083705 | Method for producing semiconductor wafers using a wire saw, wire saw, and semiconductor wafers made of monocrystalline silicon | Stefan WELSCH | 2024-09-10 |
| 11658022 | Method, control system, and system for machining a semiconductor wafer, and semiconductor wafer | Christof Weber, Stefan WELSCH | 2023-05-23 |
| 11158549 | Method, control system and plant for processing a semiconductor wafer, and semiconductor wafer | Stefan WELSCH, Christof Weber | 2021-10-26 |