Issued Patents All Time
Showing 1–25 of 56 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6713862 | Low temperature co-fired ceramic-metal packaging technology | Ponnuswamy Palanisamy, Attiganal Narayanaswamysreeram, Ellen S. Tormey, Barry Jay Thaler, John Connolly +3 more | 2004-03-30 |
| 6709749 | Method for the reduction of lateral shrinkage in multilayer circuit boards on a substrate | Ananda H. Kumar, Barry Jay Thaler | 2004-03-23 |
| 6471805 | Method of forming metal contact pads on a metal support substrate | Barry Jay Thaler | 2002-10-29 |
| 6455930 | Integrated heat sinking packages using low temperature co-fired ceramic metal circuit board technology | Ponnuswamy Palanisamy, Attiganal Narayanaswamy Sreeram, Ellen S. Tormey, Barry Jay Thaler, John Connolly +2 more | 2002-09-24 |
| 6399230 | Multilayer ceramic circuit boards with embedded resistors | Ellen S. Tormey, Ponnusamy Palinasamy | 2002-06-04 |
| 6361390 | Method for making an embossed plasma display back panel | Attiganal Narayanaswamy Sreeram, Les Hozer, Kalipada Palit | 2002-03-26 |
| 6321569 | Method for forming back panel for a plasma display device | Attiganal N. Sreeram, Robert L. Quinn | 2001-11-27 |
| 6286204 | Method for fabricating double sided ceramic circuit boards using a titanium support substrate | Attiganal Narayanaswamy Sreeram, Leszek Hozer, Kalipada Palit | 2001-09-11 |
| 6191934 | High dielectric constant embedded capacitors | Michael Liberatore, Attiganal Narayanaswamy Sreeram, In Tae Kim, Je-Do Mun, Sung-Dae Park +3 more | 2001-02-20 |
| 6168490 | Back panel for a plasma display device | Leszek Hozer, Kalipada Palit, Attiganal Narayanaswamy Sreeram, Robert L. Quinn | 2001-01-02 |
| 6140759 | Embossed plasma display back panel | Attiganal Narayanaswamy Sreeram, Les Hozer, Kalipada Palit | 2000-10-31 |
| 6140767 | Plasma display having specific substrate and barrier ribs | Attiganal N. Sreeram, Robert L. Quinn | 2000-10-31 |
| 6055151 | Multilayer ceramic circuit boards including embedded components | Ellen S. Tormey, Attiganal Narayanaswamy Sreeram, Michael Liberatore | 2000-04-25 |
| 6017642 | Low dielectric loss glasses | Ananda H. Kumar, Barry Jay Thaler, Ellen S. Tormey | 2000-01-25 |
| 6011330 | Miniature power supply | Lawrence A. Goodman | 2000-01-04 |
| 5958807 | Low dielectric loss glass ceramic compositions | Ananda H. Kumar, Barry Jay Thaler, Ellen S. Tormey | 1999-09-28 |
| 5953203 | Multilayer ceramic circuit boards including embedded capacitors | Ellen S. Tormey, Attiganal Narayanaswamy Sreeram | 1999-09-14 |
| 5880705 | Mounting structure for a tessellated electronic display having a multilayer ceramic structure and tessellated electronic display | Lubomyr Stephen Onyskevych, Satyam Choudary Cherukuri, P. Neil Yoc.o slashed.m, Kenneth Edward Salsman | 1999-03-09 |
| 5876536 | Method for the reduction of lateral shrinkage in multilayer circuit boards on a substrate | Ananda H. Kumar, Barry Jay Thaler | 1999-03-02 |
| 5866240 | Thick ceramic on metal multilayer circuit board | Ellen S. Tormey | 1999-02-02 |
| 5858145 | Method to control cavity dimensions of fired multilayer circuit boards on a support | Attinganal Narayanaswamy Sreeram, Barry Jay Thaler | 1999-01-12 |
| 5847935 | Electronic circuit chip package | Barry Jay Thaler, Ananda H. Kumar, Bernard D. Geller | 1998-12-08 |
| 5644327 | Tessellated electroluminescent display having a multilayer ceramic substrate | Lubomyr Stephen Onyskevych, Satyam Choudary Cherukuri, P. Niel Yocom, Kenneth Edward Salsman | 1997-07-01 |
| 5581876 | Method of adhering green tape to a metal support substrate with a bonding glass | Barry Jay Thaler | 1996-12-10 |
| 5514451 | Conductive via fill inks for ceramic multilayer circuit boards on support substrates | Ananda H. Kumar, Barry Jay Thaler, Ellen S. Tormey | 1996-05-07 |