Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6932674 | Method of determining the endpoint of a planarization process | Peter Lahnor, Olaf Kuehn, Alexander William Simpson | 2005-08-23 |
| 6858449 | Process and device for the abrasive machining of surfaces, in particular semiconductor wafers | Mark Hollatz | 2005-02-22 |
| 6827635 | Method of planarizing substrates | Peter Lahnor, Olaf Kuehn, Alexander William Simpson | 2004-12-07 |