| 12358084 |
Bonding head and bonding apparatus |
Matthias Fettke, Thorsten Krause, Svetlana Milz |
2025-07-15 |
| 12349287 |
Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through hole |
Matthias Fettke, Nico Lange |
2025-07-01 |
| 12171066 |
Method for removing and repositioning electronic components connected to a circuit board |
Matthias Fettke |
2024-12-17 |
| 12028987 |
Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through hole |
Matthias Fettke, Nico Lange |
2024-07-02 |
| 12023756 |
Method for removing electronic components connected to a circuit board |
Matthias Fettke |
2024-07-02 |
| 11367709 |
Semiconductor chip stack arrangement and semiconductor chip for producing such a semiconductor chip stack arrangement |
Matthias Fettke |
2022-06-21 |
| 11217558 |
Method and device for establishing a wire connection as well as a component arrangement having a wire connection |
Jan Hoffmann, Matthias Fettke |
2022-01-04 |