Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10804875 | Polymer lid wafer-level package with an electrically and thermally conductive pillar | Stephen Roy Gilbert, Martin Franosch, Suresh Sridaran, Richard C. Ruby | 2020-10-13 |
| 10256788 | Acoustic resonator including extended cavity | Siamak Fouladi Azarnaminy, David A. Feld, Qiang Zou, Mohamed Abd Allah, Jing Wu +2 more | 2019-04-09 |
| 9680445 | Packaged device including cavity package with elastic layer within molding compound | Klaus-Guenter Oppermann | 2017-06-13 |
| 6777267 | Die singulation using deep silicon etching | Richard C. Ruby, Frank S. Geefay, Cheol Han, Qing-Cao Gan | 2004-08-17 |
| 6777263 | Film deposition to enhance sealing yield of microcap wafer-level package with vias | Qing-Cao Gan, Richard C. Ruby, Frank S. Geefay | 2004-08-17 |
| 6528814 | Cryogenic, high-resolution x-ray detector with high count rate capability | Matthias Frank, Carl A. Mears, Simon E. Labov, Larry J. Hiller | 2003-03-04 |
| 6165801 | Method for making a monolithic integrated high-T.sub.c superconductor-semiconductor structure | Michael J. Burns, Paul R. de la Houssaye, Graham A. Garcia, Stephen D. Russell, Stanley R. Clayton | 2000-12-26 |
| 6051846 | Monolithic integrated high-T.sub.c superconductor-semiconductor structure | Michael J. Burns, Paul R. de la Houssaye, Graham A. Garcia, Stephen D. Russell, Stanley R. Clayton | 2000-04-18 |