Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12387310 | Wafer signature local maxima via clustering for metrology guided inspection | Marcus Liesching, Sandeep Bhagwat, Surya Vanamali, Suresh Selvaraj, Sravani Desu +3 more | 2025-08-12 |
| 11967060 | Wafer level spatial signature grouping using transfer learning | Narayani Narasimhan, P. Jithendra Kumar Reddy, Ski Sim, Osamu Yamamoto | 2024-04-23 |